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MAX2634
315MHz/433MHz Low-Noise
Amplifier for Automotive RKE
RF Input Coupling Capacitor
Input IP3 vs. Enable Time
The value of the coupling capacitor affects input IP3
and turn-on time. A larger coupling capacitor results in
Table 2. MAX2634 Typical Noise
Parameters
(V CC = +3.0V, T A = +25°C.)
higher input IP3 at the expense of longer turn-on time.
See Table 3 for the typical amount of trade-off.
Integrated Output Matching
Network and DC-Block
The MAX2634 integrates the output matching network
and DC-block, eliminating the need for external match-
ing components while providing a broadband match.
FREQUENCY
(MHz)
308
315
418
434
FMIN
(dB)
0.64
0.65
0.78
0.80
| Γ OPT |
0.50
0.49
0.44
0.44
| Γ OPT |
ANGLE
27.0
27.7
37.4
38.9
R N ( Ω )
9.78
9.78
9.87
9.88
See the Functional Diagram/Typical Operating Circuit
for component values.
Shutdown
The MAX2634 features a shutdown pin to disable the
entire chip. Apply a logic-high to the SHDN pin to place
the part in the active mode, and a logic-low to place the
part in the shutdown mode.
Table 3. RF Input Coupling Capacitor
Input IP3 vs. Enable Time
Power-Supply Bypassing
Bypassing the V CC line is necessary for optimum
gain/linearity performance. See the Functional
Diagram/Typical Operating Circuit for bypassing
capacitor values.
Layout Information
A properly designed PCB is essential to any RF/
microwave circuit. Use controlled-impedance lines on
all high-frequency inputs and outputs. Bypass with
INPUT DC-BLOCKING
CAPACITOR,
C1 (nF)
1
3.3
22
100
1000
ENABLE
TIME
(μs)
6
20
130
600
6000
INPUT IP3 AT
315MHz
(dBm)
-19
-14
-12
-11
-11
decoupling capacitors located close to the device’s
V CC pin. For long V CC lines, it may be necessary to add
additional decoupling capacitors. These additional
capacitors can be located farther away from the device
package. Proper grounding of the GND pins is essen-
tial. If the PCB uses a topside RF ground, connect it
directly to all GND pins. For a board where the ground
plane is not on the component layer, the best technique
is to connect the GND pins to the board with a plated
through-hole located close to the package.
6
PROCESS: SiGe BiCMOS
Chip Information
Maxim Integrated
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